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Manufacturing/Packaging??

Controlling process parameters for flip-chip underfill

Posted: 01 Jul 2000 ?? ?Print Version ?Bookmark and Share

Keywords:speedline technologies? underfill? temperature control? rotary valve? tce?

With new substrates adding new challenges to the flip-chip technology, engineers must tackle the difference in TCE between the die and the substrate in order to avoid the fracturing of outermost connectors during thermal cycling.

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