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UTAC teams up with M-Systems on MCPs

Posted: 18 Jan 2002 ?? ?Print Version ?Bookmark and Share

Keywords:united test and assembly center? m-systems? multi-chip package? mcp? multi-die approach?

United Test and Assembly Center Ltd (UTAC), a semiconductor assembly and test services provider, is collaborating with M-Systems to deliver MCP (Multi-Chip Package) leaded and array packages to meet the company's demand for communication devices that uses the multi-die approach.

"We are further developing solutions that integrate more than three dies while concurrently supporting passives components in one package," said Lee Hoong Leong, VP of R&D at UTAC. "This can drastically decrease the total system manufacturing cost by reducing the number of components needed as well as simplifying the overall board design."

UTAC offers MCP solutions in wide range of package outlines including TSOP, LQFP, MQFP, FBGA, PBGA and FC BGA.





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