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KLA-Tencor introduces automated wafer backside inspection system

Posted: 12 Feb 2002 ?? ?Print Version ?Bookmark and Share

Keywords:kla tencor? optical inspection machine? wafer backside inspection? backside inspection? wafer inspection?

KLA-Tencor Corp. has introduced the industry's first fully-automated wafer backside inspection system that enables non-destructive inspection of the backsides of 300mm wafers. The company claims that the Backside Inspection Module (BSIM) has a sensitivity to detect particles as small as 50nm.

BSIM is sold as an option for the company's Surfscan SP1 wafer inspection tools. It employs edge-only wafer handling throughout the measurement process, protecting the unscanned side.

The company claims the backsides of production wafers become contaminated or damaged at nearly every process step, including deposition, etch and chemical mechanical planarization (CMP). The defects can account to as much as 10 percent of a fabricator's baseline yield.

Backside defects can distortion of the front surface of wafers during subsequent photolithography exposure, causing yield-destroying "hot spots" of out-of-focus IC patterns. The defects can also migrate between processes, creating gate dielectric failures.





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