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RVSI rolls out gold bump wafer inspection system

Posted: 24 Apr 2002 ?? ?Print Version ?Bookmark and Share

Keywords:ws 2510? wafer inspection system? wafer inspection machine? gold bump wafer? bump wafer inspection?

Designed specifically to inspect wafers that employ gold bump technology, the WS-2510 from Robotic Vision Systems Inc. contains a sensor that can inspect micron-sized gold bumps at production speeds.

The system measures the height, length, and width of every bump, and also detects bridged bumps, missing and extra bumps, cracks, scratches, nodules, pits, and foreign material between the bumps.

"To the best of our knowledge, no other supplier of bumped wafer inspection systems has been able to achieve repeatable, precise 3-D measurements of gold bumps, and certainly not at production speeds," said Frank Jacovino, GM of Wafer Level Products, RVSI Electronics Division.

"At the same time, we are able to supply the required 2-D surface inspection of wafers with equally high throughput," he added.

Bumped wafers are utilized in flip-chip packaging technologies to produce smaller, faster, and more complex ICs. Most wafers are bumped using solder, but a growing sub-segment of the market uses gold bumps, which typically measure 10?m to 25?m.

Gold bump wafers are used primarily in the manufacture of LCD drivers and contain many die, each with an array of microscopic gold bumps that serve as an electrical interconnection from the die to the thin-film circuits on the glass-panel displays.





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