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LogicVision, SiidTech explore use of silicon fingerprinting

Posted: 22 Aug 2002 ?? ?Print Version ?Bookmark and Share

Keywords:die identification technology? Silicon Fingerprinting? embedded test? ASIC? SoC?

LogicVision Inc. has formed a partnership with SiidTech Inc., the pioneer and provider of the die identification technology to explore the advancement, utilization, and potential of silicon fingerprinting and embedded test in ASIC and SoC technologies.

SiidTech's technology provides the ability to identify uniquely each silicon die. This capability provides for tracking and functionality options not possible with current ID and tracing methodologies. This technology, combined with embedded test, is expected to provide test and yield management possibilities beyond the wafer-level to packaged parts.

Complementary applications between the two companies include enhancing yields, reducing debug, and final test times, and more efficient field diagnostics. Combining SiidTech's Fingerprinting technology with LogicVision's embedded test aims to narrow the gaps between chip design, chip manufacturing, and systems development.





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