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Philips-Fairchild alliance to create packaging standard

Posted: 07 Oct 2002 ?? ?Print Version ?Bookmark and Share

Keywords:ic packaging? Philips DQFN packaging? Fairchild MicroPak? tssop? sc70?

Fairchild Semiconductor and Royal Philips Electronics, two of the largest logic suppliers, have formed a working relationship to become a multi-source supplier for small-scale logic packaging.

"The purpose of the alliance is to create an industry standard for DQFN and MicroPak, and to support the growing portable market." said Mike Mui, product marketing manager, Philips, for Hong Kong, mainland China, and Korea regions.

Philips' DQFN and Fairchild"s MicroPak packaged logic are mainly for space-constrained applications such as cellular telephones, PDAs, watches, cameras, notebook computers, and other portable electronics. DQFN packaging is approximately 75 percent smaller than existing TSSOP packages, and MicroPak offers designers single- and dual-gate products that, according to Mui, provide 65 percent space savings over SC70 packages.

Helen Wong, senior product marketing manager, Interface & Logic, Asia Pacific, Fairchild, said, "the relationship will provide customers with second-sourced, premier packaging solutions with today's packages, and with future logic packaging technologies."

DQFN, designed with a footprint of 2.5-by-3mm in a 14-pin configuration, is also available in 16- and 20-pin options. Mui said that it offers 20 percent improvement in heat dissipation over a comparable TSSOP package. The package contains no leads, thereby eliminating coplanarity and bent-lead issues.

Six-terminal MicroPak has a footprint of 1.4-by-1mm, and a height of 0.55mm. The contact pads are leadless. Wong explained that these contact pads eliminate the potential loss of coplanarity during the production process, and allows the package to be soldered to the PCB more efficiently. "MicroPak's familiar overall dimensions similar to passive chips and 0.5mm terminal pitch facilitate qualification on high volume production lines," she said.

Today's logic market is "confused" because of multiple standards, and the new relationship will create the logic industry's benchmark for packaging excellence, Mui concluded.

- Kirtimaya Varma

Electronics Engineering Times - Asia





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