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NEC to improve reliability of embedded systems

Posted: 18 Dec 2002 ?? ?Print Version ?Bookmark and Share

Keywords:multilayer wiring technology? soc lsi? etching?

NEC Corp. has announced that they have developed a multilayer wiring technology that increases the reliability of sub-0.15m SoC LSI products.

The technology employs an 8nm-thick titanium film, which functions as a "glue" for a viahole contact interface which connects the upper- and lower-layer copper lines. The glue is expected to help strengthen the adhesiveness of the lines, reduce the occurrence of pores caused by thermal stress, and increase stress migration resistance tenfold compared to when the titanium film is not used.

Additionally, the company has also discovered of a unique composition of etching gas used to etch a low-k interlayer dielectric film. The technology enables a carbonitride film, about 3nm thick, to be formed on the etched surface in a self-aligning fashion.

NEC aims to incorporate the technology into its next-generation SoC LSI chips by 2005.





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