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UMC, Xilinx ready for 90nm chip manufacturing in '03

Posted: 19 Dec 2002 ?? ?Print Version ?Bookmark and Share

Keywords:programmable chips? FPGA?

Semiconductor foundry United Microelectronics Corp. (UMC) and Xilinx Inc. have announced that they are on track to produce Xilinx's latest family of programmable chips in 2H of 2003, utilizing UMC's 90nm chipmaking process technology.

UMC is preparing to manufacture the line of Xilinx FPGAs at its 300mm fabrication facility, which has already produced an FPGA test chip. According to Xilinx, its engineers can pack more transistors, layers, interconnect and product features into a single chip at 90nm, reducing die size by 50 to 80 percent, compared to other FPGA solutions. UMC's L90 process integrates nine layers of copper interconnect, 1.2V transistors, and low-k dielectric material into a single manufacturing process.

Xilinx's investment in 90nm manufacturing technology with UMC is expected to enable the company to drive pricing down for a one-million-gate FPGA.





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