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Teradyne, Kaparel to enhance PCB design performance

Posted: 24 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:pcb design? picmg 3.0? backplane design?

Teradyne Inc. and Kaparel Corp., have agreed to participate in a technology exchange aimed at improving PCB designs used with open standards, such as PICMG 3.0. This is part of a supply partnership forged between the two companies in which Teradyne's Connection Systems Division will provide Kaparel with open standard PCBs for their backplane designs.

Teradyne's PCB capabilities include prototype through production volume manufacturing of panel sizes up to 24-by-54 inches, 50mils to 500mils thick, deep microvia technology, and layer counts from 6 to 60. On the other hand, Kaparel specializes in high slot count, hot swap and high availability systems and has a complete line of standard off-the-shelf products and specializes in custom solutions.

"The global design community will greatly benefit from the combination of Teradyne's and Kaparel's engineering expertise," said Robert Cutler, high-speed signal integrity expert for RDC Consulting. "As data rates across backplanes push to 10Gbps and up, the kind of higher level engineering both companies bring to the table becomes critical to success."





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