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AIC PGA connector enables fewer board layer tests

Posted: 03 Jun 2003 ?? ?Print Version ?Bookmark and Share

Keywords:advanced interconnections? aic? surface mount? interstitial pin grid array connector? pga?

The surface-mount, interstitial PGA connector from Advanced Interconnections Corp. (AIC) involves the application of the patented BGA socket adapter system in an existing, molded PGA wafer.

The custom SMT PGA socket adapter system enables the test boards to be produced with fewer layers, eliminates the need for plated through holes, and provides a corporate test board solution.

For this application, AIC employs a two-piece PGA connector system, comprised of a molded LCP socket incorporating 3-finger low-force, gold-plated beryllium copper contacts, and an FR-4 adapter incorporating screw-machined, gold-plated brass pins. The socket and adapter are reflow soldered to the PCB's surface mount pads using BGA solder balls.





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