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Molex CoolFin heatsinks maximize thermal efficiency

Posted: 17 Jun 2003 ?? ?Print Version ?Bookmark and Share

Keywords:37430? colfin? heatsink? molex?

The 37430 series of CoolFin heatsinks from Molex Inc. reduce weight and save space while maximizing thermal efficiency for Pentium 4 FMB2 microprocessors at speeds of 3.06GHz and higher.

Weighing 495g, and measuring 88-by-72-by-44.7mm, the product feature a thermal efficiency of 0.33C/W with fan speed at 5,400rpm. It also features a "hybrid" package of stamped fins that are linked together and soldered to a copper base plate. The inner fins, which sit directly above the heat source, are made of copper to maximize thermal efficiency while the outer fins are made of nickel-plated aluminum to reduce weight.

A pair of removable retention clips is used to install and align the heatsink assembly to the CPU socket, and to apply a preload to the interface material for eliminating any air pockets. The device is available in multiple fan speeds for motherboards without variable fan speed technology, matching cooling requirements with acoustic needs.





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