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Manufacturing/Packaging??

Soitec, Seika collaborate on Asian joint venture

Posted: 05 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:soitec? seika? soi wafer? semiconductor manufacturing?

France-based Soitec, a manufacturer of SOI wafers and other engineered substrates for use in semiconductor manufacturing, announced that it will enter into an agreement with Seika Corp. to form a joint venture. Seika is the exclusive distributor of Soitec's products in China.

To be based in Tokyo, Japan, the joint venture will provide Unibond SOI wafers - and other engineered substrates manufactured using Soitec's Smart Cut technology - to the Japanese marketplace via a full direct sales and support organization. The Soitec Asian JV will also serve both South Korea and China.

Under terms of the agreement, Soitec will acquire 70 percent interest in the Soitec Asian JV, while Seika will retain 30-percent ownership of the new entity.





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