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Amkor to expand semiconductor package output

Posted: 20 Feb 2004 ?? ?Print Version ?Bookmark and Share

Keywords:amkor technology? microleadframe? semiconductor package?

Amkor Technology Inc. has revealed that it is increasing the capacity of its MicroLeadFrame (MLF) semiconductor packages by more than 50 percent within the next six months to stay ahead of the rising industry demand.

MLF is Amkor's version of an IC package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead." It is a lead frame-based, near-chip-scale package with an exposed die paddle. MLF is produced in Amkor's factories in South Korea, Philippines and Japan. In addition, the company's China plant is set to boost capacity early this year.

According to Amkor, its MLF package shipments have surged from 50 million units in 2000 to 750 million units in 2003 and with strong growth potential for 2004 and beyond.





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