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Manufacturing/Packaging??

Precision jetting allows closer component placement

Posted: 16 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:flip chip? bga? csp? precision jetting? component placement?

One of the limitations on the close placement of components has been the space requirements for underfilling flip-chips, BGAs, and CSPs; and Asymtek's new developed solution makes it unnecessary to insert the needle between components.

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