Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Networks
?
?
Networks??

Chipmakers pitch for broadband WLAN proposal

Posted: 17 Aug 2004 ?? ?Print Version ?Bookmark and Share

Keywords:wlan? broadband?

Broadcom Corp., Conexant Systems Inc., STMicroelectronics NV and Texas Instruments Inc. have formally proposed a broadband wireless standard that achieves 540Mbps data rates while maintaining interoperability with existing 802.11 WLAN devices, the companies claimed.

A consortium including the four chip makers, plus Airgo Networks and Bermai, has come together under the name "WWiSE" [for worldwide spectrum efficiency]. They announced on August 12, 2004 plans put forward a joint proposal to the IEEE 802.11 Task Group N (TGn), which is developing a next-generation Wi-Fi standard capable of sustaining data throughput in excess of 100Mbps.

The WWise proposal is based on multichannel orthogonal frequency domain multiplexing, or MIMO [multiple input, multiple output] OFDM. It builds on the 20MHz bandwidth channel format already used in existing 802.11 WLAN standards to provide backwards compatibility.

Rates up to 540Mbps would be accomplished with a 4-by-4 MIMO structure and a 40MHz bandwidth channel width - where permitted by regulatory bodies. The proposal comes with the offer of royalty-free license terms from the WWiSE companies, under a reciprocal basis, a so-called reciprocal RAND-Z licensing scheme.

Further information about the Wwise proposal to IEEE 802.11 TGn could be found at the www.wwise.org.

- Peter Clarke

Silicon Strategies





Article Comments - Chipmakers pitch for broadband WLAN ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top