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Parlex, Infineon team on substrates for electronic ID products

Posted: 04 Jan 2005 ?? ?Print Version ?Bookmark and Share

Keywords:parlex? infineon? mobile electronic identification?

Parlex Corp., a supplier of flexible interconnects, has formed a joint venture with Infineon Technologies AG to manufacture and sell advanced technology substrates for secure mobile electronic identification products.

The agreement calls for Parlex to own 51 percent of the venture with Infineon holding the remaining share. Infineon will pay Parlex $3 million and Parlex will contribute equipment and technology. The joint venture will be headquartered in Hong Kong with manufacturing facilities in China.

Parlex Shanghai Circuit Company will also provide certain additional services which will be paid for by the joint venture. In addition to supplying substrates for the Infineon Flip Chip on Substrate (FCOS) program, the joint venture will offer its products to customers worldwide.

The venture is expected to begin operating in April 2005.

- EE Times





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