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Casio licenses packaging technology to Renesas

Posted: 20 Jan 2005 ?? ?Print Version ?Bookmark and Share

Keywords:casio computer? wafer level packaging? digital camera?

Casio Computer Co. Ltd has licensed its wafer level packaging (WLP) technology to Renesas Technology Corp. in an attempt to create an industry de facto packaging standard.

Under the agreement between Casio and Reneas, Casio will make the technology available to Renesas on an ongoing basis. Renesas will be authorized to manufacture and sell chip size package products based on the WLP technology, both on its own and through its subsidiaries.

Casio licensed the technology to Amkor Technology Inc. last March, and is adding Renesas as the first Japanese licensee.

Casio's WLP, or also called W-CSP, standing for "wafer-level chip size package," interconnects aluminum pads with copper posts by copper redistribution wirings. It makes full use of the chip area and those copper wirings and posts are encapsulated with epoxy resin.

The copper wirings and posts ensures high signal transmission performance, and the simple printing encapsulating process ensures high reliability, said a Casio spokeswoman.

Casio Micronics Co. Ltd, a Casio subsidiary, produces the WLP packaging. At present, it assembles only 200mm wafers but is preparing a 300mm assembly line, slated to begin operating Fall 2005.

Renesas has already been using WLP technology from Casio Micronics for its devices sold to Casio. With the licensing agreement, Renesas now can supply devices employing the WLP technology to other customers. The wafer-level packaging suits applications such as mobile phones and digital cameras.

Renesas has its own wafer level packaging technology named Wafer Process Packaging. Renesas' WPP technology interconnects electrode pads to bumps by copper redistribution wiring but supplies bare chips without encapsulation. The process is used for car mount devices, said a Renesas spokeswoman.

- Yoshiko Hara

EE Times





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