Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Tackling physical verification below 90nm

Posted: 02 May 2005 ?? ?Print Version ?Bookmark and Share

Keywords:physical verification? subwavelength lithography? design rule check? reticle enhancement? phase shift mask?

The article reviews the key challenges of physical verification below 90nm and the methodologies needed to tackle them

View the PDF document for more information.



Article Comments - Tackling physical verification below...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top