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ICI offers Pb-free service

Posted: 17 Aug 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ic interconnect? wafer bumping? ici?

IC Interconnect (ICI), a wafer bumping service company, announced its Pb-free bumping capabilities, available now as a standard service offering.

Reducing harmful substances in the environment, especially at the manufacturing source, has become increasingly important over the last decade. Current RoHS initiatives mandate that by July 1, 2006, all new electrical and electronic equipment put on the market in European Union member states shall not contain lead, mercury, cadmium or hexavalent chromium.

As a response, ICI now offers bumping services with Pb-free solder. "From a wafer bumping standpoint, processing with Pb-free alloys required some paste and stencil adaptation. However, the electroless nickel UBM we employ is identical to our Pb-based process," explained Dr. Scott Popelar, director of engineering at IC Interconnect. "Both flip chip devices and wafer level chip scale packages have been qualified by several of our customers and are available as standard catalog part numbers in either leaded or Pb-free versions."

The company shared that they have been using electroless nickel as the UBM (under bump metallurgy) of choice since 1998. In 2001, this same UBM system was used in the development and qualification of the Pb-free alloys available today. These Pb-free alternatives fit into the existing assembly infrastructure, meet cost targets and are equal to or surpass current reliability requirements.

"The most significant concern related to switching from lead-based solder alloys to Pb-free was the reliability impact. We have processed Pb-free die that have subsequently been assembled into electronic systems by our customers and subjected to the standard battery of qualification tests for consumer and automotive applications. In both cases, they exceeded the reliability requirements," shared Curt Erickson, ICI president.




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