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Spansion, Atheros packaging solution reduces size of mobile phones

Posted: 21 Sep 2005 ?? ?Print Version ?Bookmark and Share

Keywords:atheros communications? cellular? wlan? mirrorbit flash? rocm?

Spansion LLC and Atheros Communications Inc. have developed an innovative packaging solution that is designed to reduce the size of dual-mode cellular/wireless LAN (WLAN) mobile phones. The packaging solution vertically stacks the Atheros Radio-on-Chip for Mobile (ROCm) 802.11a/g and 802.11g solutions with Spansion MirrorBit Flash memory.

The solution enables handset manufacturers to provide valuable new services, such as Voice-over-IP (VoIP) and WLAN data connectivity for fast download of content such as ring tones, music, video clips, games, and email, in very small form factors.

An innovative approach to semiconductor packaging, package-on-package (PoP) solutions vertically stack system components for board savings, lower pin-count, simplified system integration and enhanced performance. The resulting PoP enables handset suppliers increased flexibility as compared to alternative packaging solutions like system-in-package (SIP).

The PoP solutions based on the Atheros and Spansion devices will combine WLAN radio and baseband functions with the high-density code and data storage required by the vast majority of handset end-products--in a small footprint measuring only 160 mm2. In comparison, a similarly configured solution using discrete chips can be as large as 800mm2.

Amir Mashkoori, SVP, general manager of Spansion's wireless solutions division. "As handset manufacturers require more memory to enable new features and Wi-Fi to deliver the bandwidth necessary for consumers to access and download rich content and applications on their phones, Atheros and Spansion have each contributed to the suitable solution. Together, we expect both companies will play a key role in enabling cellular, Wi-Fi convergence."





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