Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

FlipChip begins construction of bumping facility

Posted: 14 Feb 2006 ?? ?Print Version ?Bookmark and Share

Keywords:wafer-level packaging? flip-chip bumping? FlipChip? Millennium Microtech?

FlipChip International LLC disclosed that it started construction of an advanced bumping facility for a new joint venture in China with Millennium Microtech (Shanghai) Co. Ltd (MMS). The joint venture will provide wafer-level packaging and flip-chip bumping services to the domestic and international semiconductor market, said the press release. The joint venture will be referred to as FCMS and will be located at MMS's existing Pu Dong facility.

According to FlipChip president and CEO Bob Forcier, the domestic consumption of flip-chip devices is expected to maintain double digit growth for the next three years and is an essential packaging technology for wireless portable devices and video phones.

FlipChip is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. It is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for wireless infrastructure in the life science, renewable energy and homeland security markets.

MMS is a subsidiary of Millennium Microtech Holding (MMH). MMH provides fully integrated semiconductor packaging and test services, including dicing, tape and reel, wafer probing, and back-grinding through MMS and Millennium Microtech (Thailand) Co. Ltd.




Article Comments - FlipChip begins construction of bump...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top