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High-capacitance passives shrink for portable devices

Posted: 07 Mar 2006 ?? ?Print Version ?Bookmark and Share

Keywords:capacitor? TAJ R? NOJ OxiCap? TLC? 572D?

TCJ series

Capacitor manufacturers are stepping up to the plate when it comes to increasing capacitance in smaller package sizes to enable design engineers to shrink the size of their next-generation portable devices. They are also making sure these devices are compliant to the European Union's Restriction of Hazardous Substances (RoHS) directive that bans six substances, including lead.

Three major players in the capacitor marketAVX, Taiyo Yuden, and Vishayhave all introduced new capacitor products that meet these market needs over the past several months.

With a sharp focus on shrinking its capacitor products while providing higher capacitance values, AVX Corp. recently introduced its low-profile TAJ "R" case size tantalum capacitor. Meeting the EU's RoHS directive, these lead-free capacitors provide high capacitance values up to 22?F in an R case size.

Offering high volumetric efficiency, the TAJ R tantalum capacitor offers capacitance values in a range from 0.1?F to 22?F with a capacitance tolerance of 10 percent to 20 percent. The operating temperature range -55C to 125C.

In addition, AVX's TCJ series of tantalum polymer capacitors devices are said to provide the industry's highest capacitance values, while shrinking their package sizes. Enabling design engineers to further shrink the size of their portable electronic device designs as well as increase their functionality, the newest TCJ series capacitors are one to three capacitance/voltage value (C/V) levels higher than other devices on the market. These devices provide capacitance values of 100?F at 4V in the 0805 size, 47?F at 6.3V in the 1206 size and 10?F at 6.3V in the 1210 size. These devices are RoHS compliant.

Designed to improve audio performance, AVX's NOJ OxiCap niobium oxide capacitors and TLC series tantalum capacitors both tout high volumetric efficiency. The tantalum capacitors deliver high C/V values in a small package for space-constrained applications while niobium oxide capacitors combine non-burn features and low-failure rates to enhance safety, reliability and performance in high-end audio applications such as flight audio systems.

The AVX NOJ OxiCap niobium oxide capacitors provide a high volumetric efficiency, and unlike aluminum devices, they do not suffer from dry out, which typically occurs at continuous operating temperatures above 40C. The TLC tantalum capacitors in a T case size are suitable for space and height-constrained applications that require high-capacitance devices. The company said tantalum is often preferred to ceramic in audio applications since high C/V multilayer ceramic capacitors (MLCCs) have an associated piezoelectric effect, causing noise at audio frequencies. Both types are manufactured and tested to comply with the latest lead-free, RoHS and JEDEC 020C requirements.

A new series of low-profile, high-capacitance solid tantalum chip capacitors from Vishay Intertechnology Inc. comes packaged in a compact P case size. Designed to provide greater functionality in handheld devices, the Vishay Sprague low-profile 572D series capacitors are designed for input/output buffering, DC/DC conversion and noise suppression applications in PDAs, cellphones, LCD display drives and other handheld and portable appliances. The 572D series capacitors feature single-sided lead-free terminations.

Taiyo Yuden said its AMK series high-capacitance MLCCs are the industry's first 100?F MLCC in a 1206 case size and 47?F MLCC in a 0805 package. The 100?F device is 59 percent smaller by volume (36 percent smaller footprint) than the previously smallest 100?F capacitor in a 1210 case size (3.2-by-2.5-by-2.5mm). The 47?F capacitor represents a 55 percent surface area reduction compared to a 47?F device in a 1206 case size.

The AMK212BJ476MG 47uF device, in particular, which measures 2-by-1.25-by-1.25mm, may be used in portable designs, including cellphones. The operating temperature range for both devices is -55C to 85C.

Taiyo Yuden said it achieved the miniaturization by using a new material technology, developed in 2004, in combination with advanced multi-stacking techniques that allowed the integration of more than 600 sub-micrometer layers.

- Gina Roos
eeProductCenter




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