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Cordless phone chipset begins roadmap to single-chip DECT

Posted: 04 May 2006 ?? ?Print Version ?Bookmark and Share

Keywords:COSIC? cordless single chip? cordless phone? Infineon? Alex Mendelsohn?

Communications IC maker Infineon Technologies announced the availability of a chipset for digital cordless phones. The company said it will also eventually integrate the digital and RF functions of its chipset to produce an industry-first single-chip Digital Enhanced Cordless Telecommunications (DECT) device.

The DECT device is anticipated to provide users with a price-competitive and performance-competitive platform for next-generation DECT phones now being defined by international standards organizations.

Presently, the chipset incorporates Infineon's Step8 DECT baseband controller. As the name implies, it's an eighth-generation device.

The Step8 provides polyphonic ringing, color display support and a microcontroller. It also packs I2C, JTAG and SPI interfaces. The Step8 is intended for use along with an RF transceiver and power amplifier (PA) stage.

The upcoming single-chip
The single-chip DECT cordless single chip (COSIC) will integrate the baseband, transceiver and PA. COSIC is expected to be a future-proof device for next-generation cordless phones.

Slated for sample availability later this year, COSIC will reduce the number of components required for a DECT system (base station and handset) by up to 50 percent, with a concurrent reduction in production cost estimated at 40 percent.

The device will combine lower cost DECT functions with an increase in board space so you can have additional so-called value features, such as VoIP and integrated message services in your design.

Not incidentally, market researchers at In-Stat forecast that the demand for residential DECT-based phones will increase from about 38 million units last year, to more then 55 million DECT phones in 2009. So, join the fun. Jump into this lucrative market niche. Check out this upcoming silicon.

0.13m CMOS
The Step8 baseband controller is manufactured in 0.13m CMOS. The Step8 package also includes software, including an API to ensure fast design-in.

Engineering samples of different variants adapted to various applications are already available and volume production will start by the third quarter of this year.

Like the Step8, the single-chip COSIC will also include color display support, full-duplex hands-free functions, polyphonic ringing, an adjustable on-chip audio amplifier and enhanced interfaces.

The architecture will support major standards such as DECT6.0 and 2.4GHz Worldwide Digital Cordless Telecommunications.

Support for 5.8GHzInfineon says it will also have support for 5.8GHz systems, made possible with an external PA. COSIC devices will also be offered in optimized variants to support low-end to high-end phones with integrated answering machines. Engineering samples of the COSIC will be available by the fourth quarter of the year. Volume production is planned for the third quarter of 2007.

- Alex Mendelsohn
eeProductCenter




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