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Tower inks MOU with SanDisk on 0.13m process

Posted: 04 Aug 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Tower Semiconductor? memorandum of understanding? 0.13micron? wafer capacity? expansion?

Tower Semiconductor Ltd has signed an memorandum of understanding (MOU) with SanDIsk Corp. to invest in the expansion of its 0.13m logic wafer capacity. Furthermore, SanDisk committed to purchase, upon such expansion, volume production quantities of 0.13m wafers during 2007 and 2008, and will have right of first refusal on the use of this extra capacity in 2009. These transactions are subject to required approvals of the parties.

"SanDisk continues to execute on an aggressive technology roadmap which has moved a large volume of our controller products to 0.13m technology," said Dr. Randhir Thakur, executive vice president of technology and worldwide operations, SanDisk. "We have a long standing business relationship with Tower, based upon Tower's best of class responsiveness to our business needs through design services, process know-how and operational flexibility."

"Being the world wide leader in flash storage card products, it is a great vote of confidence from SanDisk to both help finance the 0.13m capacity expansion and to commit to the consumption of it. We have begun manufacturing our first SanDisk products in this advanced node and have achieved quite reasonable die yields", said Russell Ellwanger, Tower CEO.

Last year, Tower announced that it was manufacturing SanDisk's memory controller at its 0.18m technology platform.




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