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Amkor selects Cadence for SiP design centers

Posted: 14 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Cadence Design? Amkor? SiP?

Amkor Technology Inc. has standardized on Cadence Design Systems Inc.'s new system-in-package (SiP) design products and methodologies for use in their worldwide design centers.

Applications driving the increased use of SiP technology include wireless, networking and consumer-electronics devices such as cell phones, Bluetooth modules, and WLAN modules. Faced with escalating customer demand for these applications and increasing SiP complexity, Amkor and Cadence collaborated on a complete, integrated solution for the implementation of digital and RF SiPs.

"Cadence SiP technology allows us to extend and enhance the value of the design and manufacturing services we deliver to our customers," said Steven Lowder, Amkor's vice president, design services. "Combining Cadence's technology with Amkor's SiP design flow will integrate silicon and package design at new levels, which will further optimize the size, performance and cost of our customer's products."

According to Keith Felton, group director, product marketing IC packaging and SiP solutions, Cadence, consumer demand for compact, functionally dense wireless and multi-media products is fueling the growth in SiP implementation. The new Cadence products support designers of the leading-edge devices by moving what was, until recently, an expert engineering-design process into the mainstream.




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