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RapidIO design summits set in Tokyo, Bangalore

Posted: 20 Sep 2006 ?? ?Print Version ?Bookmark and Share

Keywords:RapidIO? Trade Association? design summit? RapidIO Trade Association?

The RapidIO Trade Association announced that it will be holding its Asia-Pacific Global Design Summits in Tokyo, Japan and Bangalore, India on October 20 and November 29, respectively.

These summits are designed to provide information on RapidIO technology and products, and will include live multi-vendor demonstrations in the technology lab. It will include technical sessions highlighting RapidIO technology, interconnect comparisons, software considerations, RapidIO and distributed processing, wireless application design, and RapidIO products.

"These events, coming on the heels of an extremely successful Boston Design Summit, represent extraordinary opportunities for the embedded design community to learn how to get better system performance, reliability and support for convergence by using the high-speed, flexible RapidIO interconnect and fabric," said Tom Cox, executive director of the RapidIO Trade Association.

The Tokyo Summit will be held at the Century Hyatt, Shinjuku- Ku on October 20. Application papers and design tips will be presented by RapidIO ecosystem members, including Freescale Semiconductor, FuturePlus, Integrated Device Technology (IDT), Mercury Computer Systems, PMC- Sierra, Tundra Semiconductor, Texas Instruments (TI) and Xilinx.

Ecosystem members participating in the Bangalore Summit include Freescale, FuturePlus, GDA Technologies, IDT, Mercury Computer Systems, PMC-Sierra and TI. This summit will be held at the Leela Palace Hotel, Bangalore.

RapidIO technology
RapidIO technology is an established, scalable, packet-switched, high-performance fabric developed to address the needs of equipment designers in the wireless infrastructure, edge networking, storage, scientific, military and industrial markets.




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