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Master Bond adhesive is resistant up to 205C

Posted: 07 Nov 2006 ?? ?Print Version ?Bookmark and Share

Keywords:Master Bond? EP21AOHT? epoxy? adhesive? sealant?

EP21AOHT epoxy adhesive from Master Bond

Master Bond Inc. announced it has developed a two-component, high temperature-resistant, thermally conductive epoxy adhesive, sealant and coating. The EP21AOHT system promises good thermal conductivity of more than 1.44W/mK and adheres to a wide variety of substrates including metals, glass, ceramics and many plastics.

As an adhesive, the product forms strength bonds of 5,000psi in tensile strength, 2,000psi in shear and over 20,000psi in compression. Its compressive modulus is 6,20,000psi. It resists a wide range of substances including water, oils, fuels and some solvents over the temperature range of -50C to 205C.

The paste features easy application with a convenient, non-critical, one-to-one mixing ratio and a convenient self-levelling feature that allows it to go on evenly and smoothly, Master Bond said. Versatile cure schedules are available ranging from room temperature cures or fast elevated temperature cures in 40mins or starting at 65C.

The solution has electrical insulation properties with a dielectric strength greater than 400V/mil. It also features a coefficient of thermal expansion (COE/CTE) of 20in/in-by-10-6/C, low shrinkage and excellent dimensional stability.

EP21AOHT is available in pint, quart, gallon and 5-gallon container kits.




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