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RF/Microwave??

GPS receiver touts 'smallest' footprint

Posted: 17 Jan 2007 ?? ?Print Version ?Bookmark and Share

Keywords:GPS? receiver? Infineon? Global Locate? 3GPP?

Infineon Technologies AG and Global Locate Inc. have announced the development of a GPS receiver chip for mobile phones, smart phones and personal navigation devices.

The Hammerhead II chip is optimized for cellular handsets and mobile devices requiring high performance, low power and very small footprint. The diminutive single-die chip measures 3.74-by-3.59-by-0.6mm, for a total footprint of less than 14mm?, resulting in the industry's smallest GPS receiver, according to the announcement.

CSP technology
The Hammerhead II GPS receiver includes LNA, RF down-converter and signal processing baseband technology on a single RFCMOS die. The device uses chip scale packaging (CSP) technology, resulting in compact dimensions. The package features a 49-contact BGA, further simplifying layout and assembly.

"The Hammerhead II chip is the logical extension of our technical cooperation and outstanding partnership," added Donald Fuchs, executive VP of business development for Global Locate.

Like the first Hammerhead chip, the Hammerhead II chip promises industry-leading performance, delivering sensitivity to -160dBm and position fix times as fast as 1s, exceeding 3GPP specifications. In addition, the software has been optimized for personal navigation performance, and includes sophisticated algorithms to mitigate multipath errors.

Backward compatible
Hammerhead II retains the same core advantages as all previous Global Locate solutions by using the commercially proven host-based architecture. The software is completely backward-compatible with Hammerhead, allowing an easy transition to the new, smaller part as changing form-factors require.

The Hammerhead II chip is currently sampling, with production quantities available next month. Infineon and Global Locate are jointly marketing the chip.




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