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Thermoelectric component adds new features

Posted: 18 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:embedded thermoelectric component? enhanced eTEC material? consistent temperature differentials?

Nextreme's enhanced miniature eTEC material

Nextreme Thermal Solutions has enhanced its miniature embedded thermoelectric component (eTEC) material. The technology add-ons enable the consistent achievement of temperature differentials from 55 to 60C with eTECs at room temperature.

This achievement compares favorably with the performance of conventional thermoelectric technology, which is physically larger and typically produces 65C under the similar conditions. Nextreme claims that its devices employ proprietary materials that are 5-15?m thick, about 100 times thinner than the typical 1mm thick pellets used in conventional thermoelectric devices.

"It is remarkable that devices no thicker than a piece of paper can deliver this kind of performance," said David Koester, VP of engineering at Nextreme. "This should have an immediate impact in photonics and other industries where a lack of an integrated cooling solution is limiting market penetration of various products."

Nextreme's eTECs are designed using thin films that are small, thin, fast, efficient and reliable, adding as little as 100?m (0.1mm) of height to a heat spreader or package. This also enables unobtrusive integration close to the heat source, added the company. The eTEC's ultra fast, millisecond response time rapidly cools or heats to maintain a precise temperature depending on the needs of the application. A typical device pumps a maximum heat flux of 150W/cm? with some designs delivering as much as 400W/cm? versus 10-20W/cm? for typical bulk TECs.

According to Nextreme, its eTEC solutions can be used for applications in semiconductors, optoelectronics, sensors, bio-medical, DNA-array chips, military/aerospace, automotive, power generation and heat measurement (calorimetry). Prototypes are available for sampling and are expected fully qualified by Q3 '07.




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