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40V MOSFET trims board space, system cost

Posted: 25 May 2007 ?? ?Print Version ?Bookmark and Share

Keywords:40V MOSFETs? cut system cost? reduce board space?

Fairchild Semiconductor introduces the FDD8424H, a complementary 40V MOSFET that provides Dual DPAK packaging and industry-leading thermal dissipation to increase system reliability, reduce board space and decrease overall system cost.

Optimized for half- or full-bridge inverter designs, FDD8424H is suited for use in backlighting units (BLU) for LCD TVs, LCD monitors, motor drives and lamp drives. Compared to alternative solutions, the FDD8424H in Dual DPAK provides thermal resistance that is five and 10 times lower than solutions using 8-lead and dual SOIC (SO8) packages, respectively. Moreover, the integration of a P-channel high-side MOSFET and an N-channel low-side MOSFET into a single package allows a common drain connection within the device, simplifying board layout and reducing design time.

"FDD8424H offers display designers the ability to optimize the footprint and the thermal performance of their inverter designs," said Mike Speed, Fairchild's marketing manager for Communications and Consumer Products. "The FDD8424H provides 12 percent lower case temperature in backlighting inverters while driving eight CCFL lamps."

FDD8424H features a combination of Rds(on) and gate charge provides excellent switching performance. It has a thermal resistance (Theta JC) of 4.1C/W for N-channel and 3.5 C/W for P-channel. The device is a half-bridge solution in one package that reduces device footprint and overall system cost. The integration of P-channel and N-channel MOSFETs with common drain connection simplifies the layout.

Pricing for 1000-unit quantities starts at 69 cents. Delivery is from 6 to 8 weeks.




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