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New interconnects, signal integrity devices roll

Posted: 04 Jun 2007 ?? ?Print Version ?Bookmark and Share

Keywords:interconnects? cable assemblies? board-to-board applications? PCB design?

Samtec Inc. unveils new interconnects and signal integrity services for panel and I/O, cable assemblies and board-to-board applications. The products are the latest addition to the company's Signal Integrity at any Distance device family. Samtec also said that it has expanded signal integrity design resources including Final Inch PCB design tools.

Board-to-board solutions include single-ended and differential pair Q Series, Q2 Series and Edge Rate connector strips, elevated board stackers, right angle and card edge systems for perpendicular and coplanar board mating. Various high-density solutions are available including connectors support up to 500 I/Os" target=_blank>SEARAY open pin field arrays, HD Mezz elevated stacking arrays and DP Array dedicated differential arrays.

Cable solutions feature Samtec's data rate high-speed coax and twinax cable or high speed flex terminated with different high speed and standard connectors. Data rate I/O interfaces are available with conventional shielded twisted pair cable construction or Samtec's low skew pair cable for higher speed applications.




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