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eASIC, Tensilica team on low-cost customized ASICs

Posted: 28 Nov 2007 ?? ?Print Version ?Bookmark and Share

Keywords:customized ASIC? diamond standard processor? FPGA?

Tensilica Inc. and eASIC Corp. have entered a partnership aimed at removing the cost barriers for developing custom embedded SoCs.

The collaboration provides eASIC free access to Tensilica's Diamond Standard microprocessor and DSP cores for its free mask charge, no-minimum order ASICs. This combination enables embedded system designers to develop Diamond processor-based SoCs for applications in any production volume. Designers will be able to develop customized, highly differentiated ASIC solutions at a lower cost than FPGA-based embedded systems.

Tensilica's processors range from a very small, low-power 32bit controller up to the industry's highest performance DSP core and a multifunction audio processor that has been designed into millions of cellular phones.

"Free Tensilica processors on zero-mask charge structured ASICs is a revolutionary breakthrough in reducing the upfront costs for customers looking to develop low-cost custom embedded processing systems at any volume," stated Jasbinder Bhoot, senior director, marketing at eASIC. "This partnership is proof that a new era of SOC is upon us. No upfront cost and no minimum order quantity for an embedded processor core on a high-performance and volume-capable ASIC."

"Several of our customers have been attracted to eASIC's Nextreme Structured ASICs for fast prototyping or mass production," stated Chris Jones, Tensilica's director of strategic alliances. "eASIC's Structured ASIC technology offers customers a lower power, higher density solution than FPGAs at a much lower cost and faster time to market than cell-based ASICs."




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