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Car MCUs tailored for new emission standards

Posted: 01 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:emission standards? car MCU? DSP?

To meet the performance requirements of next-generation emission standards, Infineon Technologies has launched what it claims is the industry's highest-performing and most integrated MCU family for automotive powertrain and chassis applications. The Audo Future family of 32bit MCUs uses the TriCore core that combines MCU functions with DSP and high-density flash memory.

The Audo Future family includes the first FlexRay communications block that has been approved by TUV Nord Group's Institute for Vehicle Technology and Mobility, combined with Autosar software and a peripheral control processor that offers additional system performance.

Comprised of three devices, the scalable Audo Future family ranges from the 180MHz TC1797 device with 4Mbytes of flash and integrated FlexRay controller, to the 133MHz or 80MHz TC1767 device with 2Mbytes of flash, to the entry-level 80MHz TC1736 device with 1Mbyte of flash. A wide range of on-chip peripherals are handled by a dedicated, programmable peripheral control processor (PCP) engine, allowing the TriCore core to focus on engine management, transmission control and other powertrain functions.

The Audo Future family is fully compatible with the company's previous Audo Next-Generation family of 32bit MCUs, allowing developers of powertrain applications to easily upgrade their designs with existing tools to handle new emission standards, particularly EURO5 and EURO6 (e.g. with piezo direct injection engines).

With up to 66 percent higher performance than the previous Audo Next-Generation products, the Audo Future family is well-suited for the upcoming OBD2 (OnBoard Diagnostics for the vehicle's self-diagnostic functions such as emissions monitoring) requirements and emission standards such as EURO6 and Tier2 Bin5 in the United States, which require more complex algorithms and higher performance.

The family comes in low-quad flat pack (LQFP) packages with 144 or 176 pins or BGA packages with 260 or 416 balls.

Pricing ranges from approximately $14.50 to approximately about $29 in quantities of 100,000, depending on the configuration and packaging.

Samples are available. High-volume production is expected to begin in 2009.

- Gina Roos
eeProductCenter




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