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ESD architecture simplifies design, cuts cost

Posted: 01 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:ESD architecture? diode array? ESD protection diode?

California Micro Devices has released the PicoGuard XS ESD protection architecture that eliminates the need for external compensation to match line impedance, reducing design complexity and cost by integrating inductors with the ESD protection diodes.

Two important trends are leading to fundamental changes in system level ESD protection requirements: increased susceptibility of system ICs to ESD strikes as they migrate to more advanced process technologies, and increasingly demanding signal integrity requirements as data rates continue to climb. Traditional ESD protection devices are optimized for either ESD protection or signal integrity but not both. The traditional approach to improving signal integrity, reducing the capacitance of the ESD protection structures, also tends to reduce ESD performance. The PicoGuard XS architecture eliminates this tradeoff by improving ESD protection while simultaneously providing excellent signal integrity and minimizing design complexity.

Impedance matching
Traditionally, system designers must compensate for the capacitance of the ESD protection device by adding external inductance, eliminating capacitance under the signal traces near the ESD device, or both. These approaches add complexity and cost, and are PCB dependent, limiting the ability to use multiple board vendors. By integrating the inductance into the ESD device, PicoGuard XS eliminates the need for these measures providing matched impedance with no external compensation or components required.

The first PicoGuard XS product is the CM1233-08DE, offering 8 channels of ESD protection. It provides protection for four pairs of differential channels, offering ESD protection to IEC61000-4-2 Level 4 8kV contact discharge. System designers can easily meet the 100? differential impedance requirements of HDMI and DisplayPort using these devices, with no external compensation required. The integration of inductors with the ESD diodes provides for improved ESD protection as well as better signal integrity.

The CM1233-08DE also offers 40 percent reduction in peak clamping voltage, 15-40 percent reduction in peak residual current, and straight through routing for improved layout compared to other EDS diode arrays and, CMD said.

"System developers no longer need to make a tradeoff between signal integrity and ESD protection," stated Joe Salvador, director of marketing for digital consumer and computing products at CMD. "This is particularly important for high speed interfaces such as HDMI 1.3 and the new DisplayPort interface which requires a minimum of 8kV contact protection on all lines."

The CM1233 is available in a 16-lead TDFN package. It is currently sampling and will be in full production this quarter. Pricing is at 57 cents each at 1,000 units.




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