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Chip takes place of three in XFP modules

Posted: 26 Feb 2008 ?? ?Print Version ?Bookmark and Share

Keywords:single-chip solution? analog signal processing?

A single-chip solution featuring 10Gbit/s dual clock data recovery (CDR) with electronic dispersion compensation engine for use in 10GBASE-LRM XFP modules has been announced by Inphi Corp.

The 3200E integrates Inphi's patented analog signal processing EDC technology with XFI-compliant transmit and receive CDRs in a compact 7mm x 7mm QFN package. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the BOM of an XFP transceiver module.

Used with Inphi's 1348TA linear trans-impedance amplifier (TIA), the 3200EC reduces development costs and accelerates delivery of standards-compliant 10GBASE-LRM XFP modules.

The devices are available immediately as engineering samples with mass production expected in the second quarter of 2008.

- Ismini Scouras
eeProductCenter




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