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Spansion, SMIC forge 43nm fab deal

Posted: 25 Aug 2008 ?? ?Print Version ?Bookmark and Share

Keywords:foundry? NOR memory? flash memory? 43nm?

Spansion Inc. has expanded its foundry arrangement with China's Semiconductor Manufacturing International Corp. (SMIC) to include 43nm production.

As part of the plan, NOR-flash memory supplier Spansion has extended its current agreement with SMIC for the production of 65nm MirrorBit NOR to include the manufacture of 43nm MirrorBit Ornand2 memory devices on 300mm wafers.

Based on the company's MirrorBit charge trapping technology, MirrorBit Ornand2 is designed to support faster write performance and a wide range of densities.

At present, Spansion is selling 65nm NOR devices. After establishing its Submicron Development Center (SDC) in Sunnyvale, Spansion plans to transition 43nm technology to SMIC's 300mm facility in Wuhan, China.

At the same time, Spansion also plans to ramp production of its 45nm products such as EcoRAM, MirrorBit NOR and Eclipse at its own SP1 300mm wafer fabrication facility in Aizu-Wakamatsu, Japan by 2009.

The company expects to meet the development of 32nm MirrorBit technology for MirrorBit ORNAND2, MirrorBit Eclipse and EcoRAM at its SDC facility and ramp the technology to production in 2010.

Spansion, a NOR supplier, seems to be racing with its main rival. Numonyx BV, its close competitor, recently signed on its first silicon foundry partner, announcing a deal with Elpida Memory Inc.

Under the agreement, Elpida will make NOR-based flash memory devices in its 300mm wafer fab in Hiroshima for Numonyx. Elpida will produce 65nm and 45nm devices on a foundry basis for the flash-memory vendor. DRAM specialist Elpida recently entered the foundry market, as part of an agreement with United Microelectronics Corp.

- Mark LaPedus
EE Times





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