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Migrating designs in ProASIC3 devices from higher-density to mid-density devices

Posted: 25 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:ProASIC3 device? design migrating?

This application note describes design migration among ProASIC3 family devices with an emphasis on package pin compatibility. The ProASIC3 family of devices shares numerous common architectural features. During a system migration, care should be taken regarding the architectural features of each core. Additionally, a key requirement is running functional simulation before and after the migration, using Actel tools.

View the PDF document for more information.





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