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Board mounting application note for 0.800mm pitch devices

Posted: 09 Dec 2008 ?? ?Print Version ?Bookmark and Share

Keywords:mounting board? wafer package level? devices MOSFET?

International Rectifier's wafer level package (WLP) technology now includes the FlipFET range of Hexfet power MOSFET devices (in which modified die design places source, drain and gate bumps on the front of the die) and also the 1A FlipKY range of Schottky diode devices (where the anode and cathode are both placed on the front of the die). The 0.5A range of FlipKY product is covered in AN-1079.

To simplify board mounting and improve reliability, International Rectifier manufactures WLP devices to exacting standards. These high standards have evolved through evaluating many different materials and designs. Although such evaluations have yielded good results, the recommendations in this application note may need to be adjusted to suit specific production environments.

View the PDF document for more information.





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