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Ramtron to install F-RAM process tech in IBM facility

Posted: 16 Feb 2009 ?? ?Print Version ?Bookmark and Share

Keywords:Ramtron F-RAM? technology process? manufacturing IBM?

Ramtron International Corp. has entered into a foundry services agreement with IBM. The companies plan to install Ramtron's ferroelectric RAM (F-RAM) semiconductor process technology in IBM's Burlington, Vermont wafer manufacturing facility. Once installed, the new foundry supply will serve as a foundation for the introduction of new and cost-effective high-performance F-RAM semiconductor products.

"We look forward to increased manufacturing capacity through our foundry relationship with IBM to help meet the growing demand for Ramtron's F-RAM semiconductor products," said Bob Djokovich, Ramtron chief operating officer. "We are pleased to help facilitate the expansion of Ramtron's F-RAM product offerings," said John DiToro, VP of semiconductor manufacturing at IBM systems and technology group. "The vast array of IP blocks available through IBM foundry services can provide Ramtron with a great deal of product development flexibility. We look forward to working with Ramtron to help the company reach its manufacturing and product development objectives."

Ramtron expects to generate first production wafers during 2010 on the IBM 0.18?m wafer manufacturing process. IBM will become Ramtron's third foundry supplier for its F-RAM semiconductor products, along with Fujitsu Ltd and Texas Instruments Inc.

In tandem with the foundry agreement, Ramtron is in the process of establishing an $11 million loan facility through Silicon Valley Bank to fund the capital and development costs in connection with the foundry relationship with IBM. In addition, Ramtron is working with Silicon Valley Bank to extend the company's revolving line of credit (LOC) until March of 2012, and increase the amount that can be borrowed under the LOC to a total of $5 million. Ramtron's existing LOC allows for borrowings of up to $4 million. To date, Ramtron has no amount outstanding on its line of credit. The new loan facility is expected to close during Q1 09.





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