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Testing RF ICs with DigRF interconnects

Posted: 17 Mar 2009 ?? ?Print Version ?Bookmark and Share

Keywords:RF IC? RF test? interconnect? standard DigRF? application note?

The multi-gigabit DigRF standard is rapidly emerging as the next-generation serial interface between mobile baseband and RF ICs because it removes the inter-chip communication bottleneck. However, the ongoing evolution of the DigRF standard introduces multiple levels of complexity in design and test due to protocol changes and a fast 3 Gb/s serial link. Couple that with the inclusion of MIMO techniques and new RF modulation formats within handset designs and the problems become even tougher.

Whether you are a digital engineer faced with making RF-type measurements or an RF engineer trying to make digital measurements, this note will help you achieve your measurement goals. The content presented here covers four major areasdigital/physical, digital/protocol, RF/physical and RF/protocolbut focuses on the challenges of testing the RF ICs used in next-generation formats such as WiMAX and LTE. Today's designs have new measurement needs and will benefit from new test methodologies that address many of these challenges, providing useful results and new insights across the digital and RF domains.

View the PDF document for more information.





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