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Clamping of high power RF transistors and RFICs in over-molded plastic packages

Posted: 01 Jul 2009 ?? ?Print Version ?Bookmark and Share

Keywords:RF transistor? RFIC? power amplifier? assembly process?

This document provides customers with a guide for mounting high power RF transistors and RFICs in over-molded plastic (OMP) packages by clamping down the RF power device in the power amplifier (PA) housing. Each PA design has its own unique characteristics. Similarly, each manufacturing operation also has its own process capabilities and variations. Therefore, each design and assembly may require some fine - tuning.

The intent of this application note is to provide customers with the information necessary to derive the best possible process that is most suitable for their design and the assembly process that is most compatible with their manufacturing operation.

View the PDF document for more information.





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