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Huawei, Qualcomm achieve 42Mbit/s HSPA+ downlink

Posted: 05 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:HSPA+? 3G? network?

Huawei and Qualcomm Inc. have successfully completed one of the industry's first interoperability tests on dual carrier HSPA+ (High Speed Packet Access Plus) technology. The test, which reached a peak downlink data rate of 42Mb/s, the fastest downlink rate experienced by 3G end-users, demonstrates that dual-carrier HSPA+ technology is ready for commercial deployment.

Huawei' s latest HSPA+ solution and Qualcomm' s Mobile Data Modem MDM8220 chipsets were used in this interoperability test. Implemented with dual cell technology, Huawei's HSPA+ solution can transmit data via two or more carriers, resulting in the downlink data rate of 42Mbit/s, which improves an operator' s spectrum resources, enhances spectral efficiency by up to 20 percent1 and doubles user data rates across the coverage area of a dual cell HSPA+ network.

"Qualcomm is pleased to be working with Huawei to bring dual-carrier HSPA+ technologies to market," said Alex Katouzian, VP of product management, Qualcomm CDMA Technologies. "We remain committed to W-CDMA modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world."

Wan Biao, president of wireless, Huawei, said, "Achieving higher speeds is a constant pursuit for customers and their subscribers. As a customer-centric company, Huawei is dedicated to developing innovative technology and cost-effective solutions and services. In cooperation with Qualcomm, we are able to deliver the latest in commercially available mobile broadband technology and user devices."





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