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Tessera, Nanium ink packaging license deal

Posted: 23 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:license agreement? packaging? semiconductor?

Tessera Inc. has signed a technology licensing agreement with Nanium, S.A, formerly known as Qimonda Portugal.

Under the agreement, Nanium has licensed Tessera's semiconductor packaging technology covering a broad range of chip scale, multichip and flip chip package types. These technologies include integrated circuit devices packaged in "face-down," "face-up," "stacked-die," "package on package," "system-in-package," and "flip chip" formats, utilizing many different types of materials, including packages using either tape- or laminate-based package substrates.

"Our packaging technologies are foundational elements for the DRAM industry, and will be for many years," said Henry R. Nothhaft, chairman and CEO, Tessera. "In addition to licensing Tessera's innovative chip scale packaging technologies, Nanium has licensed a broad range of Tessera's packaging portfolio. As a result, it will be able to offer its customers an extensive variety of Tessera-enabled packages and technologies to fit their needs, including flip chip, stacked-die, and stacked package configurations."

"Having access to Tessera's packaging technologies will allow us to grow and serve customers in the DRAM market and throughout the semiconductor industry," said Armando Tavares, Nanium's president of the executive board. "We can now offer our customers leading edge, licensed technologies to enable their products and businesses."





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