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Bosch opens 200mm wafer fab in Reutlingen

Posted: 30 Mar 2010 ?? ?Print Version ?Bookmark and Share

Keywords:Bosh 200mm fab? wafer fab? MEMS?

Robert Bosch GmbH has formally opened a 200mm wafer fab in Reutlingen. The fab, which cost 600 million euros (about $1.1 billion), will make a variety of ICs including MEMS.

Once the fab is fully equipped, which is scheduled to take up to 2016, the plant will be capable of producing a million chips per day and employ 800 people, the company said.

The 200mm wafer fab has been built along-side a 6-inch wafer fab that has been in operation since 1995. ICs produced on the sire are used in electronic control units in automobile engines, electronic stabilizers and ride control, airbag, night-vision and driver assistance systems. However, Bosch said that its MEMS devices are being used, increasingly, in consumer electronics such as notebook computers and cellphones.

Bosch has also set up a test center at its Reutlingen location. There the semiconductor circuits and MEMS sensors are finally tested and programmed according to their eventual applications.

"Despite the economic crisis, we had the will, the strength, and the resources to see this project through," said Franz Fehrenbach, the chairman of the Bosch board of management, at the opening of the wafer fab.

"Making engines even more economical and making driving even safer, will only be feasible with an increasing level of technology, particularly electronics," Fehrenbach said.

- Peter Clarke
EE Times





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