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Assembly guidelines for Power33 packaging

Posted: 30 Apr 2010 ?? ?Print Version ?Bookmark and Share

Keywords:Power33 packaging? backend processing? assembly guidelines?

The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70 percent smaller. This packaging technology has been increasingly used for power related products due to its low package height, and excellent thermal performance for size. This is largely due to the large thermal pad in the center of the package which solder directly to the printed wiring board (PWB) and allows a more direct thermal and electrical path from the drain terminal out of the package. This application note focuses on the soldering and back end processing of the Power33.

View the PDF document for more information.

Click here to view related datasheets.





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