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FCI, CESP sign polymer collar tech agreement

Posted: 19 Aug 2010 ?? ?Print Version ?Bookmark and Share

Keywords:polymer? patent license agreement? wafer? packaging?

FlipChip International (FCI) has announced the signing of a patent license agreement with Cookson Electronics Semiconductor Products (CESP) covering its intention to facilitate the use of polymer collar technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices.

By purchasing polymer flux from Cookson, package manufacturers will be allowed to utilize the Polymer Collar process while eliminating any concern on patent infringement.

CESP's vice president and general manager, Chris Bastecki says, "FCI has developed some valuable IP for the industry. We have found that most of the leading package suppliers to the hand-held market have a strong interest in Polymer Collar technology, but have been reluctant to implement the technology due to their concern over possible patent infringement."





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