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Siemens, National Semi team up for ultrasound, 3D/4D

Posted: 13 Sep 2010 ?? ?Print Version ?Bookmark and Share

Keywords:ultrasound? imaging? 3D?

Siemens Medical Solutions USA Inc. and National Semiconductor Corp. (NSC) are teaming up to advance ultrasound technology. The strategic alliance is set create ultrasound imaging systems with enhanced image quality and advanced 3D/4D imaging capabilities, that will also use less power.

NSC will provide power management, signal path and transducer solutions to Siemens ultrasound systems. Together, the companies aim to provide medical ultrasound systems that change the game in workflow efficiency, diagnostic reliability and ease of scanning.

"For many years, we have been pushing the envelope to advance ultrasound imaging to the next level. Large data volumes and the increased demand for portability require systems with an effective balance between power efficiency and performance. We view National Semiconductor as a strategic analog alliance to help us make this happen," said Norbert Gaus, CEO, clinical products division, Siemens Healthcare.

"This is an ideal alliance, which effectively leverages both companies' strengths. Already well known for its world-class healthcare solutions, Siemens' next-generation ultrasound systems will be enhanced by our high-performance technology, chipsets and subsystem-level solutions," said Mike Polacek, senior VP of key market segments and business development for NSC.





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