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Hynix orders ESI laser link processing system

Posted: 20 Oct 2010 ?? ?Print Version ?Bookmark and Share

Keywords:laser link processing? DRAM manufacturing equipment?

Electro Scientific Industries reports that Hynix Semiconductor Inc. has ordered its 9850TPIR+ laser link processing system. The company claims that its 9850TPIR+ (tailored-pulse IR plus) has been adopted rapidly since its introduction in July of this year. It says that Hynix will use the 9850TPIR+ for advanced DRAM and embedded memory manufacturing.

Seong Dong Lee, director of test engineering, Hynix, noted that "ESI's tailored-pulse laser fuse architecture roadmap is well aligned with our aggressive needs to design and process memory products with innovative designs." He added that the move will "help us meet our low cost of ownership goals for our DRAM and embedded memory applications."

ESI's Model 9850TPIR+ laser link processing system is designed for high volume production environments for DRAM and embedded memory devices. The system features ESI's proprietary tailored-pulse laser technology that includes high resolution temporal pulse profiling and high repetition rates to support the newest, most challenging fuse designs. The 9850TPIR+ delivers fast fuse blowing, while exceeding the accuracy and precision requirements for 40nm class DRAM manufacturing.





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