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Toppan-IBM photomask agreement to cover 193nm immersion lithography

Posted: 20 Jan 2011 ?? ?Print Version ?Bookmark and Share

Keywords:photomask manufacturing process? 14nm logic technology node? ArF immersion lithography?

Toppan Printing Co. Ltd of Japan and IBM have extended their joint development agreement on an innovative photomask process involving the 14nm technology node for logic devices. The extension will cover 193nm immersion lithography for that node.

The development work will take place at IBM's photomask facility in Essex Junction, Vermont, and Toppan's Asaka photomask facility in Niiza, Saitama, Japan, from January 2011 through 2012.

''Several new technologies including extreme ultraviolet (EUV) have been evaluated for next-generation lithography solutions. While Toppan Printing is committed to supporting those developments, IBM has successfully developed a technology roadmap for ArF immersion lithography, a current mainstream technology that allows its extension to the 14nm generation through the use of IBM's highly regarded resolution enhancement techniques. As a result, Toppan and IBM will focus their joint development efforts on ArF immersion lithography for the 14nm node,'' according to Toppan.

''The 14nm logic technology node is likely to be the final node capable of being produced with optical lithography alone, and may prove to be an early transition point into EUV development. Future nodes are expected to deploy EUV lithography in order to print features beyond the diffraction limit associated with 193nm lithography,'' according to Toppan.

This new agreement represents the continuation of a partnership that began in 2005 with 45nm photomask process development, and has progressed through the 32nm, 28nm, 22nm, and 20nm technology nodes. The jointly developed photomask manufacturing processes have been essential contributors to advanced wafer process development by IBM and its partners in East Fishkill and Albany, New York.

Mark LaPedus
EE Times





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