Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Interface
?
?
Interface??

Elpida, PTI, UMC join forces for TSV tech

Posted: 02 Jun 2011 ?? ?Print Version ?Bookmark and Share

Keywords:3D processing? 28nm? advanced manufacturing?

Elpida Memory Inc. (Elpida), Powertech Technology Inc. (PTI), and United Microelectronics Corp. (UMC) has announced that they have finalized a three-way collaboration to deliver 3D IC integration technologies for advanced manufacturing processes including 28nm.

The co-operation focuses on through-silicon-via (TSV) technology to establish a reliable approach to logic-plus-DRAM, according to the companies.

UMC and PTI engineers are now working at Elpida's Hiroshima plant on the joint development of the TSV products. The companies said they would make use Elpida's strengths in DRAM, UMC in logic and PTI in assembly to develop logic-plus-DRAM components.

The collaboration includes works on logic-to-DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers.

The companies did not state how the technology would be taken to market. However, the resulting technology is expected to reduce costs, improve logic yields, and accelerate entry into the 3D IC market. The mention of logic yields and assembly for customers suggests that an extension of UMC's foundry chip manufacture to include 3D packaging could be one route to market.

- Peter Clarke
??EE Times





Article Comments - Elpida, PTI, UMC join forces for TSV...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top